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GSI Technology GS8161Z36DGD-150
GS8161Z36DGD-150
BGA-165
29498816-GS8161Z36DGD-150
ZBT SRAM, 512KX36, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
- Factory Lead Time6 Weeks, 6 Days
- Package / CaseBGA-165
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Terminals165
- Supplier PackageFBGA
- Data Rate ArchitectureSDR
- Typical Operating Supply Voltage2.5, 3.3 V
- Minimum Operating Supply Voltage2.3, 3 V
- Timing TypeSynchronous
- Number of Words512 kWords
- Number of I/O Lines36 Bit
- Maximum Operating Supply Voltage2.7, 3.6 V
- MountingSurface Mount
- Moisture SensitiveYes
- Maximum Clock Frequency150 MHz
- Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 70 C - Supply Voltage-Max3.6 V
- Minimum Operating Temperature0 C
- Factory Pack QuantityFactory Pack Quantity36
- Supply Voltage-Min2.3 V
- Mounting StylesSMD/SMT
- Interface TypeParallel
- ManufacturerGSI Technology
- BrandGSI Technology
- TradenameNBT SRAM
- RoHSDetails
- Memory TypesSDR
- Package DescriptionLBGA,
- Package StyleGRID ARRAY, LOW PROFILE
- Number of Words Code512000
- Package Body MaterialPLASTIC/EPOXY
- Reflow Temperature-Max (s)NOT SPECIFIED
- Access Time-Max7.5 ns
- Operating Temperature-Max70 °C
- Rohs CodeYes
- Manufacturer Part NumberGS8161Z36DGD-150
- Supply Voltage-Nom (Vsup)2.5 V
- Package CodeLBGA
- Package ShapeRECTANGULAR
- Part Life Cycle CodeActive
- Ihs ManufacturerGSI TECHNOLOGY
- Risk Rank5.26
- Part Package CodeBGA
- Usage LevelCommercial grade
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
0 to 70 °C - SeriesGS8161Z36DGD
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray - ECCN Code3A991.B.2.B
- TypeNBT
- Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8542.32.00.41 - SubcategoryMemory & Data Storage
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
BALL - Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Terminal Pitch
The center distance from one pole to the next.
1 mm - Reach Compliance Codecompliant
- Pin Count
a count of all of the component leads (or pins)
165 - JESD-30 CodeR-PBGA-B165
- Supply Voltage-Max (Vsup)2.7 V
- Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
COMMERCIAL - Supply Voltage-Min (Vsup)2.3 V
- Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
18 Mbit - Number of Ports
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
4 - Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
SYNCHRONOUS - Supply Current-Max180 mA, 190 mA
- Access Time7.5 ns
- ArchitectureFlow-Through/Pipelined
- Organization512 k x 36
- Seated Height-Max1.4 mm
- Memory Width36
- Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
SRAM - Density18 Mbit
- Memory Density18874368 bit
- Screening LevelCommercial
- Parallel/SerialPARALLEL
- Memory IC TypeZBT SRAM
- Product Category
a particular group of related products.
SRAM - Width13 mm
- Length15 mm
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