GSI Technology GS816036DGT-250

Factory Lead Time

10 Weeks

Package / Case

TQFP-100

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

100

Moisture Sensitive

Yes

Maximum Clock Frequency

250 MHz

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

0 C

Factory Pack QuantityFactory Pack Quantity

36

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI Technology

Brand

GSI Technology

Tradename

SyncBurst

RoHS

Details

Memory Types

SDR

Package Description

LQFP,

Package Style

FLATPACK, LOW PROFILE

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Access Time-Max

5.5 ns

Operating Temperature-Max

70 °C

Rohs Code

Yes

Manufacturer Part Number

GS816036DGT-250

Number of Words

524288 words

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

LQFP

Package Shape

RECTANGULAR

Part Life Cycle Code

Active

Ihs Manufacturer

GSI TECHNOLOGY

Risk Rank

5.32

Part Package Code

QFP

Series

GS816036DGT

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

ECCN Code

3A991.B.2.B

Type

Pipeline/Flow Through

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.32.00.41

Subcategory

Memory & Data Storage

Technology

CMOS

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.65 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

100

JESD-30 Code

R-PQFP-G100

Supply Voltage-Max (Vsup)

2.7 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Voltage-Min (Vsup)

2.3 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

18 Mbit

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Supply Current-Max

230 mA, 250 mA

Access Time

5.5 ns

Organization

512 k x 36

Seated Height-Max

1.6 mm

Memory Width

36

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

SRAM

Memory Density

18874368 bit

Parallel/Serial

PARALLEL

Memory IC Type

CACHE SRAM

Product Category

a particular group of related products.

SRAM

Width

14 mm

Length

20 mm