GSI Technology GS8644Z36E-166I

Factory Lead Time

8 Weeks

Package / Case

BGA-165

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

165

Maximum Clock Rate

142.8@Flow-Through/166@Pipelined MHz

Supplier Package

FBGA

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

2.3, 3 V

Number of I/O Lines

36 Bit

Maximum Operating Supply Voltage

2.7, 3.6 V

Moisture Sensitive

Yes

Maximum Clock Frequency

166 MHz

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

3.6 V

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

15

Supply Voltage-Min

2.3 V

Mounting Styles

SMD/SMT

Interface Type

Parallel

Manufacturer

GSI Technology

Brand

GSI Technology

Tradename

NBT SRAM

Memory Types

SDR

Package Description

BGA, BGA165,11X15,40

Package Style

GRID ARRAY

Moisture Sensitivity Levels

3

Number of Words Code

2000000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA165,11X15,40

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Access Time-Max

7 ns

Operating Temperature-Max

85 °C

Rohs Code

No

Manufacturer Part Number

GS8644Z36E-166I

Clock Frequency-Max (fCLK)

166 MHz

Number of Words

2097152 words

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

BGA

Package Shape

RECTANGULAR

Part Life Cycle Code

Active

Ihs Manufacturer

GSI TECHNOLOGY

Risk Rank

5.14

Part Package Code

BGA

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40 to 85 °C

Series

GS8644Z36E

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Pbfree Code

No

ECCN Code

3A991.B.2.B

Type

NBT

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.32.00.41

Subcategory

Memory & Data Storage

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

165

JESD-30 Code

R-PBGA-B165

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Supply Voltage-Max (Vsup)

2.7 V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

2.5/3.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.3 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

72 Mbit

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Supply Current-Max

285 mA, 345 mA

Access Time

7@Flow-Through/3.5@P

Organization

2 M x 36

Output Characteristics

3-STATE

Seated Height-Max

1.5 mm

Memory Width

36

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

SRAM

Standby Current-Max

0.16 A

Memory Density

72

Parallel/Serial

PARALLEL

I/O Type

COMMON

Memory IC Type

ZBT SRAM

Standby Voltage-Min

2.3 V

Product Category

a particular group of related products.

SRAM

Width

15 mm

Length

17 mm