Global Power GDP15S120B

Mounting Type

Through Hole

Package / Case

TO-247-2

Supplier Device Package

TO-247-2

Series

Amp+™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Speed

No Recovery Time > 500mA (Io)

Diode Type

Silicon Carbide Schottky

Current - Reverse Leakage @ Vr

100µA @ 1200V

Voltage - Forward (Vf) (Max) @ If

1.7V @ 15A

Operating Temperature - Junction

-55°C ~ 135°C

Voltage - DC Reverse (Vr) (Max)

1200V

Current - Average Rectified (Io)

15A (DC)

Capacitance @ Vr, F

895pF @ 1V, 1MHz

Reverse Recovery Time (trr)

0ns