G3R40MT12D

GeneSiC Semiconductor G3R40MT12D

Part No:

G3R40MT12D

Datasheet:

-

Package:

48-TFSOP (0.240, 6.10mm Width)

AINNX NO:

34309714-G3R40MT12D

Description:

Silicon Carbide MOSFET N Channel Enhancement Mode

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    48-TFSOP (0.240, 6.10mm Width)
  • Supplier Device Package
    48-TSSOP
  • Frequency-Max
    220MHz
  • Continuous Drain Current Id
    71A
  • Package
    Tube
  • Base Product Number
    G3R40
  • Current - Continuous Drain (Id) @ 25℃
    71A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On)
    15V
  • Mfr
    GeneSiC Semiconductor
  • Power Dissipation (Max)
    333W (Tc)
  • Product Status
    Active
  • Vds - Drain-Source Breakdown Voltage
    1.2 kV
  • Vgs th - Gate-Source Threshold Voltage
    2.7 V
  • Pd - Power Dissipation
    297 W
  • Transistor Polarity
    N-Channel
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Vgs - Gate-Source Voltage
    - 5 V, + 15 V
  • Minimum Operating Temperature
    - 55 C
  • Mounting Styles
    Through Hole
  • Channel Mode
    Enhancement
  • Qg - Gate Charge
    88 nC
  • Rds On - Drain-Source Resistance
    40 mOhms
  • Id - Continuous Drain Current
    63 A
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 70°C
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Technology
    SiCFET (Silicon Carbide)
  • Voltage - Supply
    3.135 V ~ 3.465 V
  • Base Part Number
    ICS9DB108
  • Output
    Clock
  • Number of Channels
    1 Channel
  • Number of Circuits
    1
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    333W
  • FET Type
    N-Channel
  • Rds On (Max) @ Id, Vgs
    48mOhm @ 35A, 15V
  • Vgs(th) (Max) @ Id
    2.69V @ 10mA
  • Input Capacitance (Ciss) (Max) @ Vds
    2929 pF @ 800 V
  • Gate Charge (Qg) (Max) @ Vgs
    106 nC @ 15 V
  • Drain to Source Voltage (Vdss)
    1200 V
  • Vgs (Max)
    ±15V
  • Input
    Clock
  • Ratio - Input:Output
    1:8
  • PLL
    Yes
  • Differential - Input:Output
    Yes/Yes
  • Channel Type
    N Channel
  • Main Purpose
    PCI Express (PCIe)
  • FET Feature
    -
0 Similar Products Remaining