G2R120MT33J

GeneSiC Semiconductor G2R120MT33J

Part No:

G2R120MT33J

Datasheet:

-

Package:

TO-263-8, D2Pak (7 Leads + Tab), TO-263CA

AINNX NO:

28373028-G2R120MT33J

Description:

SIC MOSFET N-CH TO263-7

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-263-8, D2Pak (7 Leads + Tab), TO-263CA
  • Supplier Device Package
    TO-263-7
  • Mfr
    GeneSiC Semiconductor
  • Package
    Tube
  • Product Status
    Active
  • Current - Continuous Drain (Id) @ 25℃
    35A
  • Drive Voltage (Max Rds On, Min Rds On)
    20V
  • Power Dissipation (Max)
    -
  • Base Product Number
    G2R120
  • Continuous Drain Current Id
    35A
  • Vds - Drain-Source Breakdown Voltage
    3.3 kV
  • Typical Turn-On Delay Time
    96 ns
  • Vgs th - Gate-Source Threshold Voltage
    4.5 V
  • Pd - Power Dissipation
    366 W
  • Transistor Polarity
    N-Channel
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Vgs - Gate-Source Voltage
    - 5 V, + 20 V
  • Unit Weight
    0.056438 oz
  • Minimum Operating Temperature
    - 55 C
  • Factory Pack QuantityFactory Pack Quantity
    50
  • Mounting Styles
    SMD/SMT
  • Forward Transconductance - Min
    5.8 S
  • Channel Mode
    Enhancement
  • Manufacturer
    GeneSiC Semiconductor
  • Brand
    GeneSiC Semiconductor
  • Qg - Gate Charge
    130 nC
  • Rds On - Drain-Source Resistance
    120 mOhms
  • RoHS
    Details
  • Typical Turn-Off Delay Time
    35 ns
  • Id - Continuous Drain Current
    34 A
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 175°C (TJ)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Type
    SiC MOSFET
  • Subcategory
    MOSFETs
  • Configuration
    Single
  • Number of Channels
    1 Channel
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    402W
  • FET Type
    N-Channel
  • Rds On (Max) @ Id, Vgs
    156mOhm @ 20A, 20V
  • Vgs(th) (Max) @ Id
    -
  • Input Capacitance (Ciss) (Max) @ Vds
    3706 pF @ 1000 V
  • Gate Charge (Qg) (Max) @ Vgs
    145 nC @ 20 V
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    26 ns
  • Drain to Source Voltage (Vdss)
    3300 V
  • Vgs (Max)
    +25V, -10V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    MOSFET
  • Transistor Type
    MOSFET
  • Channel Type
    N Channel
  • FET Feature
    -
  • Product
    MOSFET
  • Product Category

    a particular group of related products.

    MOSFET
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