GeneSiC Semiconductor G3F18MT12K

Package / Case

TO-247-4

RoHS

RoHS Compliant

Mounting Styles

Through Hole

Transistor Polarity

N-Channel

Vds - Drain-Source Breakdown Voltage

1.2 kV

Rds On - Drain-Source Resistance

18 mOhms

Channel Mode

Enhancement

Factory Pack Quantity

30

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

G3F

Configuration

Single

Number of Channels

1 Channel