GeneSiC Semiconductor G3F65MT12K

Package / Case

TO-247-4

Factory Pack Quantity

30

Channel Mode

Enhancement

Rds On - Drain-Source Resistance

65 mOhms

Vds - Drain-Source Breakdown Voltage

1.2 kV

Transistor Polarity

N-Channel

Mounting Styles

Through Hole

RoHS

RoHS Compliant

Series

G3F

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Configuration

Single

Number of Channels

1 Channel