EPC B82422H1102K008

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Yes

PPAP

Unknown

Protection Style

Molded

Inductance (H)

1u

Inductance Test Frequency (Hz)

2.52M

Maximum DC Current (A)

1.15

Maximum Saturation Current (A)

1.15

Maximum DC Resistance (Ohm)

0.1

Minimum Quality Factor

10

Quality Test Frequency (Hz)

2.52M

Minimum Self Resonant Frequency (Hz)

150M

Case Size

1210

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Product Depth (mm)

2.7

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Power Chip

Product Length (mm)

3.4

Product Height (mm)

2.4