B82464Z4222M000

EPC B82464Z4222M000

Part No:

B82464Z4222M000

Manufacturer:

EPC

Datasheet:

-

Package:

-

AINNX NO:

31960001-B82464Z4222M000

Description:

Products specifications
  • Number of Terminals
    2
  • Core Material

    Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

    Ferrite
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Protection Style
    Shielded
  • Inductance (H)
    2.2u
  • Inductance Test Frequency (Hz)
    100K
  • Maximum DC Current (A)
    6.5
  • Maximum Saturation Current (A)
    7
  • Maximum DC Resistance (Ohm)
    0.01
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Mounting
    Surface Mount
  • Product Depth (mm)
    10.4
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Tolerance
    20%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    Power
  • Product Length (mm)
    10.4
  • Product Height (mm)
    4.8
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