EPC B82498B3560J000

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ceramic

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Inductance (H)

0.056u

Inductance Test Frequency (Hz)

200M

Maximum DC Current (A)

0.48

Maximum Saturation Current (A)

0.48

Maximum DC Resistance (Ohm)

0.14

Minimum Quality Factor

45

Quality Test Frequency (Hz)

200M

Minimum Self Resonant Frequency (Hz)

1700M

Case Size

0805

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Mounting

Surface Mount

Product Depth (mm)

1.4

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

5%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Type

General Purpose Chip

Product Length (mm)

2.2

Product Height (mm)

1.45