EPC B82141B1153K000

Number of Terminals

2

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

Ferrite

EU RoHS

Compliant with Exemption

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Inductance (H)

15u

Inductance Decrease Percentage @ Isat (%)

&l;=10

Inductance Test Frequency (Hz)

100K

Maximum DC Current (A)

0.365

Maximum DC Resistance (Ohm)

0.74

Minimum Quality Factor

55

Quality Test Frequency (Hz)

2.52M

Minimum Self Resonant Frequency (Hz)

17M

Mounting

Through Hole

Terminal Pitch (mm)

5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

125

Product Diameter (mm)

3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

RF Choke

Lead Style

Radial

Product Height (mm)

13