ADUCM360BCPZ128-R7

Analog Devices Inc. ADUCM360BCPZ128-R7

Part No:

ADUCM360BCPZ128-R7

Manufacturer:

Analog Devices Inc.

Datasheet:

Package:

48-WFQFN Exposed Pad, CSP

ROHS:

AINNX NO:

4865377-ADUCM360BCPZ128-R7

Description:

IC MCU 32BIT 128KB FLASH 48LFCSP

Products specifications
  • Lifecycle Status
    PRODUCTION (Last Updated: 1 month ago)
  • Factory Lead Time
    16 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    48-WFQFN Exposed Pad, CSP
  • Number of Pins
    48
  • Data Converters
    A/D 11x24b; D/A 1x12b
  • Number of I/Os
    19
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Series
    ADuCM
  • JESD-609 Code
    e3
  • Pbfree Code
    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    48
  • Terminal Finish
    Matte Tin (Sn)
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5mm
  • Frequency
    16MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    ADUCM360
  • Pin Count

    a count of all of the component leads (or pins)

    48
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    1.8V
  • Interface
    I2C, SPI, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    128kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    8K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.8V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Single-Core
  • Program Memory Size
    128KB 128K x 8
  • Connectivity
    I2C, SPI, UART/USART
  • Bit Size
    32
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    32b
  • PWM Channels
    YES
  • Number of Timers/Counters
    2
  • Resolution
    3 B
  • Sampling Rate

    often described in the context of signal processing as the number of samples per time.

    3.906 ksps
  • Core Architecture
    ARM
  • CPU Family
    CORTEX-M3
  • Number of ADC Channels
    11
  • Length
    7mm
  • Height Seated (Max)
    0.8mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Contains Lead
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