Analog Devices Inc. ADUC824BSZ

Lifecycle Status

PRODUCTION (Last Updated: 3 weeks ago)

Factory Lead Time

8 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

52-QFP

Number of Pins

52

Data Converters

A/D 3x16b, 4x24b; D/A 1x12b

Number of I/Os

34

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

MicroConverter® ADuC8xx

JESD-609 Code

e3

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

52

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ALSO OPERATES AT 5V SUPPLY

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Frequency

12.58MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

ADUC824

Pin Count

a count of all of the component leads (or pins)

52

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

5V

Interface

EBI/EMI, I2C, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

8kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

2.7V~5.25V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER

Core Processor

8052

Peripherals

POR, PSM, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

8-Bit

Program Memory Size

8KB 8K x 8

Connectivity

EBI/EMI, I2C, SPI, UART/USART

Bit Size

8

Access Time

12.6 μs

Has ADC

YES

DMA Channels

NO

Data Bus Width

8b

PWM Channels

NO

Number of Timers/Counters

3

Resolution

3 B

Sampling Rate

often described in the context of signal processing as the number of samples per time.

105 sps

EEPROM Size

640 x 8

Number of Programmable I/O

26

Number of ADC Channels

4

Number of I2C Channels

1

Height

2.09mm

Length

10.11mm

Width

10.11mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead