Analog Devices Inc. ADUC7026BSTZ62

Lifecycle Status

PRODUCTION (Last Updated: 3 weeks ago)

Factory Lead Time

16 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

80-LQFP

Number of Pins

80

Data Converters

A/D 12 x12b; D/A 4x12b

Number of I/Os

40

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~125°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

MicroConverter® ADuC7xxx

JESD-609 Code

e3

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

80

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

120mW

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

260

Supply Voltage

3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

44MHz

Time@Peak Reflow Temperature-Max (s)

40

Base Part Number

ADUC7026

Pin Count

a count of all of the component leads (or pins)

80

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Interface

EBI/EMI, I2C, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

62kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

2K x 32

Voltage - Supply (Vcc/Vdd)

2.7V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Number of Bits

16

Core Processor

ARM7®

Peripherals

PLA, PWM, PSM, Temp Sensor, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

16/32-Bit

Program Memory Size

62KB 31K x16

Connectivity

EBI/EMI, I2C, SPI, UART/USART

Bit Size

32

Access Time

44 μs

Has ADC

YES

DMA Channels

NO

Data Bus Width

16b

Number of Timers/Counters

4

Resolution

1.5 B

Sampling Rate

often described in the context of signal processing as the number of samples per time.

1 Msps

Density

496 kb

Core Architecture

ARM

Number of ADC Channels

12

Number of PWM Channels

6

Number of I2C Channels

2

Number of SPI Channels

1

Height

1.4mm

Length

12mm

Width

12mm

REACH SVHC

No SVHC

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead