Analog Devices Inc. ADUCM320BBCZI

Lifecycle Status

PRODUCTION (Last Updated: 4 weeks ago)

Factory Lead Time

20 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

96-TFBGA, CSPBGA

Number of Pins

96

Data Converters

A/D 16x14b; D/A 12x12b

Number of I/Os

40

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

ADuCM

JESD-609 Code

e1

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

96

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1W

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

80MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

ADUCM320

Pin Count

a count of all of the component leads (or pins)

96

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Number of Channels

16

Interface

I2C, SPI, UART, USART

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256kB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

32K x 8

Voltage - Supply (Vcc/Vdd)

2.9V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

256KB 128K x 8 x 2

Connectivity

I2C, SPI, UART/USART

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

PWM Channels

YES

DAC Channels

YES

Number of Timers/Counters

3

Resolution

1.75 B

Sampling Rate

often described in the context of signal processing as the number of samples per time.

1 Msps

Core Architecture

ARM

On Chip Program ROM Width

8

Number of Programmable I/O

39

Number of UART Channels

1

Length

6mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Contains Lead