XCS30XL-5BG256C

AMD XCS30XL-5BG256C

Part No:

XCS30XL-5BG256C

Manufacturer:

AMD

Datasheet:

-

Package:

256-BBGA

AINNX NO:

43809101-XCS30XL-5BG256C

Description:

IC FPGA 192 I/O 256BGA

Products specifications
  • Mount
    Flanges, Panel
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BBGA
  • Supplier Device Package
    256-PBGA (27x27)
  • RoHS
    Compliant
  • Number of I/Os
    192
  • Package
    Tray
  • Base Product Number
    XCS30XL
  • Mfr
    AMD
  • Product Status
    Obsolete
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 85°C (TJ)
  • Series
    Spartan®-XL
  • Termination
    Solder
  • Number of Rows
    1
  • Voltage - Supply
    3V ~ 3.6V
  • Shielding
    Shielded
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Number of Logic Elements/Cells
    1368
  • Total RAM Bits
    18432
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    30000
  • Number of LABs/CLBs
    576
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