XC6SLX150-N3FGG676I

AMD XC6SLX150-N3FGG676I

Part No:

XC6SLX150-N3FGG676I

Manufacturer:

AMD

Datasheet:

-

Package:

676-BGA

AINNX NO:

43785960-XC6SLX150-N3FGG676I

Description:

IC FPGA 498 I/O 676FBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BGA
  • Supplier Device Package
    676-FBGA (27x27)
  • RoHS
    Details
  • Brand
    Welwyn Components / TT Electronics
  • Manufacturer
    TT Electronics
  • Mounting Styles
    PCB Mount
  • Factory Pack QuantityFactory Pack Quantity
    5000
  • Unit Weight
    0.000071 oz
  • Case Code - mm
    1608
  • Case Code - in
    0603
  • Qualification
    AEC-Q200
  • Number of I/Os
    498
  • Package
    Tray
  • Base Product Number
    XC6SLX150
  • Mfr
    AMD
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    MouseReel
  • Series
    PCF
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Resistance
    56 Ohms
  • Subcategory
    Resistors
  • Technology
    Thin Film
  • Voltage - Supply
    1.14V ~ 1.26V
  • Number of Logic Elements/Cells
    147443
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Thin Film Resistors
  • Total RAM Bits
    4939776
  • Number of LABs/CLBs
    11519
  • Features
    -
  • Product Category

    a particular group of related products.

    Thin Film Resistors - SMD
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