XC4062XL-1HQ304I

AMD XC4062XL-1HQ304I

Part No:

XC4062XL-1HQ304I

Manufacturer:

AMD

Datasheet:

-

Package:

304-BFQFP Exposed Pad

AINNX NO:

43807945-XC4062XL-1HQ304I

Description:

IC FPGA 256 I/O 304PQFP

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    304-BFQFP Exposed Pad
  • Supplier Device Package
    304-PQFP (40x40)
  • Factory Pack QuantityFactory Pack Quantity
    100
  • Manufacturer
    Amphenol
  • Brand
    Amphenol Commercial Products
  • Number of I/Os
    256
  • Package
    Tray
  • Base Product Number
    XC4062XL
  • Mfr
    AMD
  • Product Status
    Obsolete
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bag
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Series
    XC4000E/X
  • Subcategory
    Cable Assemblies
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Logic Elements/Cells
    5472
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Specialized Cables
  • Total RAM Bits
    73728
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    62000
  • Number of LABs/CLBs
    2304
  • Product Category

    a particular group of related products.

    Specialized Cables
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