Xilinx Inc. XCF128XFTG64C

Factory Lead Time

10 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Mounting Type

Surface Mount

Package / Case

64-TBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

64

Memory Types

FLASH

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2005

JESD-609 Code

e1

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

64

ECCN Code

EAR99

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Voltage - Supply

1.7V~2V

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Number of Functions

1

Supply Voltage

1.8V

Terminal Pitch

The center distance from one pole to the next.

1mm

Frequency

50MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

XCF128X

Pin Count

a count of all of the component leads (or pins)

64

Supply Voltage-Max (Vsup)

2V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.81.8/3.3V

Supply Voltage-Min (Vsup)

1.7V

Programmable Type

These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

In System Programmable

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

128Mb

Access Time

85 ns

Organization

8MX16

Memory Width

16

Standby Current-Max

0.000075A

Memory Density

134217728 bit

Parallel/Serial

PARALLEL

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

1.8V

Data Polling

NO

Toggle Bit

NO

Command User Interface

YES

Number of Sectors/Size

4127

Page Size

4words

Ready/Busy

YES

Common Flash Interface

YES

Length

13mm

Height Seated (Max)

1.2mm

Width

10mm

REACH SVHC

Unknown

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant