Xilinx Inc. XCF01SVO20C

Factory Lead Time

10 Weeks

Mounting Type

Surface Mount

Package / Case

20-TSSOP (0.173, 4.40mm Width)

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

20

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~85°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

1999

JESD-609 Code

e0

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

20

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn85Pb15)

Voltage - Supply

3V~3.6V

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

225

Number of Functions

1

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.65mm

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

XCF*S

Pin Count

a count of all of the component leads (or pins)

20

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3V

Supply Voltage-Max (Vsup)

3.6V

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.8/3.33V

Supply Voltage-Min (Vsup)

3V

Programmable Type

These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

In System Programmable

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

1Mb

Organization

1MX1

Memory Width

1

Standby Current-Max

0.001A

Memory Density

1048576 bit

Parallel/Serial

SERIAL

Memory IC Type

CONFIGURATION MEMORY

Data Retention Time-Min

20

Length

6.5024mm

Height Seated (Max)

1.19mm

Width

4.4mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead