XCF128XFT64C

Xilinx Inc. XCF128XFT64C

Part No:

XCF128XFT64C

Manufacturer:

Xilinx Inc.

Package:

64-TBGA

AINNX NO:

6058369-XCF128XFT64C

Description:

Configuration Device 64-Pin FTBGA

Products specifications
  • Factory Lead Time
    10 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Lead, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    64-TBGA
  • Number of Pins
    64
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2007
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Voltage - Supply
    1.7V~2V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    XCF128X
  • Pin Count

    a count of all of the component leads (or pins)

    64
  • Supply Voltage-Max (Vsup)
    2V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.81.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    In System Programmable
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    128Mb
  • Organization
    8MX16
  • Memory Width
    16
  • Standby Current-Max
    0.000075A
  • Memory Density
    134217728 bit
  • Access Time (Max)
    85 ns
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    1.8V
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    4127
  • Page Size
    4words
  • Ready/Busy
    YES
  • Common Flash Interface
    YES
  • Length
    13mm
  • Height Seated (Max)
    1.2mm
  • Width
    10mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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