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W29N01HZBINF/TRAY

Winbond Electronics Corporation W29N01HZBINF/TRAY

Part No:

W29N01HZBINF/TRAY

Datasheet:

-

Package:

-

AINNX NO:

31955073-W29N01HZBINF/TRAY

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    SLC NAND
  • Chip Density (bit)
    1G
  • Block Organization
    Symmetrical
  • Address Bus Width (bit)
    28
  • Number of Bits/Word (bit)
    8
  • Number of Words
    128M
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Maximum Erase Time (S)
    0.01/Block
  • Maximum Programming Time (ms)
    0.7/Page
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    1.7
  • Typical Operating Supply Voltage (V)
    1.8
  • Maximum Operating Supply Voltage (V)
    1.95
  • Operating Current (mA)
    25
  • Program Current (mA)
    25
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    No
  • ECC Support
    Yes
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Mounting
    Surface Mount
  • Package Height
    0.6(Max)
  • Package Width
    9
  • Package Length
    11
  • PCB changed
    63
  • Supplier Package
    VFBGA
  • Pin Count

    a count of all of the component leads (or pins)

    63
  • Architecture
    Sectored
  • Sector Size
    128Kbyte x 1024
  • Page Size
    2Kbyte
  • Boot Block
    No
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