Winbond Electronics Corporation W29N04GVSIAF TR

Mounting Type

Surface Mount

Package / Case

48-TFSOP (0.724, 18.40mm Width)

Supplier Device Package

48-TSOP

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

Yes

PPAP

Unknown

Cell Type

SLC NAND

Chip Density (bit)

4G

Block Organization

Symmetrical

Address Bus Width (bit)

30

Number of Bits/Word (bit)

8

Number of Words

512M

Programmability

Yes

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

35

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

Yes

Support of Page Mode

No

Mounting

Surface Mount

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Supplier Package

TSOP

Package

Tape & Reel (TR)

Mfr

Winbond Electronics

Product Status

Active

Memory Types

Non-Volatile

Supply Voltage-Nom (Vsup)

2.7V - 3.6V

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Series

-

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

SLC NAND Flash

Technology

FLASH - NAND (SLC)

Voltage - Supply

2.7V ~ 3.6V

Pin Count

a count of all of the component leads (or pins)

48

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

4Gbit

Speed

40MHz

Access Time

25 ns

Memory Format

FLASH

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

ONFI

Architecture

Sectored

Organization

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

Write Cycle Time - Word, Page

25ns, 700µs

Memory Density

4Gb

Sector Size

128Kbyte x 4096

Page Size

2Kbyte

Boot Block

No

Temperature

40ºC ~ 85ºC / -40ºC ~ 105ºC

Memory Organization

512M x 8