Winbond Electronics Corporation W25X05CLSNIG/TRAY

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

512K

Block Organization

Symmetrical

Location of Boot Block

Top|Bottom

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

64K

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

8

Maximum Erase Time (S)

2/Chip

Maximum Programming Time (ms)

0.8/Page

Interface Type

Serial (SPI, Dual SPI)

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

3.3|2.5

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.3 to 3.6

Operating Current (mA)

14

Program Current (mA)

12

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Mounting

Surface Mount

Package Height

1.5(Max)

Package Width

4(Max)

Package Length

5(Max)

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Architecture

Sectored

Sector Size

4Kbyte x 16

Page Size

256byte

Boot Block

Yes