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W25Q128BVFJG/REEL

Winbond Electronics Corporation W25Q128BVFJG/REEL

Part No:

W25Q128BVFJG/REEL

Datasheet:

-

Package:

-

AINNX NO:

31955054-W25Q128BVFJG/REEL

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    128M
  • Block Organization
    Symmetrical
  • Address Bus Width (bit)
    24
  • Number of Bits/Word (bit)
    8
  • Number of Words
    16M
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    8.5
  • Maximum Erase Time (S)
    40/Chip
  • Maximum Programming Time (ms)
    3/Page
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    18
  • Program Current (mA)
    12
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Mounting
    Surface Mount
  • Package Height
    2.31
  • Package Width
    7.49
  • Package Length
    10.31
  • PCB changed
    16
  • Standard Package Name
    SOP
  • Supplier Package
    SOIC
  • Lead Shape
    Gull-wing
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Pin Count

    a count of all of the component leads (or pins)

    16
  • Architecture
    Sectored
  • Sector Size
    4Kbyte x 4096
  • Page Size
    256byte
  • Boot Block
    No
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