WeEn Semiconductors BYV30B-600PJ

Mounting Type

Surface Mount

Package / Case

TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10μA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.55V @ 30A

Operating Temperature - Junction

175°C Max

Voltage - DC Reverse (Vr) (Max)

600V

Current - Average Rectified (Io)

30A

Reverse Recovery Time

75ns