WeEn Semiconductors BYC8X-600P,127

Mounting Type

Through Hole

Package / Case

TO-220-2 Full Pack, Isolated Tab

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Elements

1

Operating Temperature (Max.)

175°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Terminal Finish

Tin (Sn)

Applications

HYPER FAST RECOVERY POWER

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LOW LEAKAGE CURRENT

Terminal Position

SINGLE

Reach Compliance Code

not_compliant

Base Part Number

BYC8-600

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T2

Configuration

SINGLE

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

20μA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.9V @ 8A

Operating Temperature - Junction

175°C Max

Voltage - DC Reverse (Vr) (Max)

600V

Current - Average Rectified (Io)

8A

Number of Phases

1

Reverse Recovery Time

18ns

Rep Pk Reverse Voltage-Max

600V

JEDEC-95 Code

TO-220AC

Non-rep Pk Forward Current-Max

100A

Reverse Current-Max

20μA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant