WeEn Semiconductors BYV25FD-600,118

Mounting Type

Surface Mount

Package / Case

TO-252-3, DPak (2 Leads + Tab), SC-63

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Diode Element Material

SILICON

Number of Elements

1

Operating Temperature (Max.)

150°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

2

Terminal Finish

Tin (Sn)

Applications

ULTRA FAST SOFT RECOVERY POWER

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Reach Compliance Code

not_compliant

Base Part Number

BYV25-600

Reference Standard

IEC-60134

JESD-30 Code

R-PSSO-G2

Configuration

SINGLE

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

50μA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.9V @ 5A

Case Connection

CATHODE

Operating Temperature - Junction

150°C Max

Voltage - DC Reverse (Vr) (Max)

600V

Current - Average Rectified (Io)

5A

Number of Phases

1

Reverse Recovery Time

35ns

Rep Pk Reverse Voltage-Max

600V

Non-rep Pk Forward Current-Max

66A

Reverse Current-Max

50μA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant