VO3120-X007T

Vishay Semiconductor Opto Division VO3120-X007T

Part No:

VO3120-X007T

Datasheet:

VO3120

Package:

8-SMD, Gull Wing

ROHS:

AINNX NO:

1519551-VO3120-X007T

Description:

Optocoupler Drive Totem-Pole 1-CH 32V 1500V 8-Pin PDIP SMD T/R

Products specifications
  • Factory Lead Time
    6 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SMD, Gull Wing
  • Number of Pins
    8
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~110°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    1995
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    295mW
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54mm
  • Pin Count

    a count of all of the component leads (or pins)

    8
  • Approval Agency
    cUR, UR
  • Voltage - Isolation
    5300Vrms
  • Output Voltage
    500mV
  • Max Output Current

    The maximum current that can be supplied to the load.

    2.5A
  • Supply Voltage-Max (Vsup)
    32V
  • Number of Channels
    1
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    295mW
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    2.5A
  • Voltage - Forward (Vf) (Typ)
    1.6V Max
  • Propagation Delay

    the flight time of packets over the transmission link and is limited by the speed of light.

    400 ns
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    400 ns
  • Forward Current

    Current which flows upon application of forward voltage.

    25mA
  • Max Output Voltage

    The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

    500mV
  • Direction
    Unidirectional
  • Rise Time

    In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

    100ns
  • Fall Time (Typ)
    100 ns
  • Rise / Fall Time (Typ)
    100ns 100ns
  • Reverse Breakdown Voltage
    5V
  • Interface IC Type
    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER
  • Turn On Time

    The time that it takes a gate circuit to allow a current to reach its full value.

    0.4 μs
  • Input Current
    16mA
  • Propagation Delay tpLH / tpHL (Max)
    400ns, 400ns
  • Common Mode Transient Immunity (Min)
    25kV/μs
  • Output Peak Current Limit-Nom
    2.5A
  • High Side Driver
    NO
  • Turn Off Time
    0.4 μs
  • Reverse Voltage (DC)
    5V
  • Pulse Width Distortion (PWD)
    200 ns
  • Voltage - Output Supply
    15V~32V
  • Length
    9.77mm
  • Height Seated (Max)
    4.6mm
  • REACH SVHC
    Unknown
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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