Toshiba Semiconductor and Storage TBAT54S,LM

Factory Lead Time

12 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Diode Element Material

SILICON

Number of Elements

2

Operating Temperature (Max.)

150°C

Power Dissipation (Max)

0.32W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Digi-Reel®

Published

2016

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PDSO-G3

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

2μA @ 25V

Voltage - Forward (Vf) (Max) @ If

580mV @ 100mA

Operating Temperature - Junction

-55°C~150°C

Output Current-Max

0.2A

Current - Average Rectified (Io)

200mA

Max Reverse Voltage (DC)

30V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

140mA

Reverse Recovery Time

1.5 ns

Diode Configuration

1 Pair Series Connection

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant