Toshiba 2SK2508

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Package Description

LEAD FREE, SC-67, 3 PIN

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

No

Manufacturer Part Number

2SK2508

Package Shape

RECTANGULAR

Manufacturer

Toshiba America Electronic Components

Number of Elements

1

Part Life Cycle Code

End Of Life

Ihs Manufacturer

TOSHIBA CORP

Risk Rank

5.37

Part Package Code

SC-67

Drain Current-Max (ID)

13 A

Pbfree Code

No

ECCN Code

EAR99

Subcategory

FET General Purpose Power

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

ISOLATED

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain Current-Max (Abs) (ID)

13 A

Drain-source On Resistance-Max

0.25 Ω

Pulsed Drain Current-Max (IDM)

52 A

DS Breakdown Voltage-Min

250 V

Avalanche Energy Rating (Eas)

148 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

45 W

Power Dissipation Ambient-Max

45 W