SSM3K329R,LF

Toshiba Semiconductor and Storage SSM3K329R,LF

Part No:

SSM3K329R,LF

Datasheet:

-

Package:

SOT-23-3 Flat Leads

ROHS:

AINNX NO:

6385688-SSM3K329R,LF

Description:

MOSFET N CH 30V 3.5A 2-3Z1A

Products specifications
  • Factory Lead Time
    16 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    SOT-23-3 Flat Leads
  • Transistor Element Material
    SILICON
  • Current - Continuous Drain (Id) @ 25℃
    3.5A Ta
  • Drive Voltage (Max Rds On, Min Rds On)
    1.8V 4V
  • Number of Elements
    1
  • Power Dissipation (Max)
    1W Ta
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    6.4 ns
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    150°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    U-MOSIII
  • Published
    2007
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    3
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reach Compliance Code
    unknown
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PDSO-F3
  • Configuration
    SINGLE WITH BUILT-IN DIODE
  • Number of Channels
    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ENHANCEMENT MODE
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    1W
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    9.2 ns
  • FET Type
    N-Channel
  • Transistor Application
    SWITCHING
  • Rds On (Max) @ Id, Vgs
    126m Ω @ 1A, 4V
  • Vgs(th) (Max) @ Id
    1V @ 1mA
  • Input Capacitance (Ciss) (Max) @ Vds
    123pF @ 15V
  • Gate Charge (Qg) (Max) @ Vgs
    1.5nC @ 4V
  • Vgs (Max)
    ±12V
  • Continuous Drain Current (ID)
    3.5A
  • Gate to Source Voltage (Vgs)
    12V
  • Drain to Source Breakdown Voltage
    30V
  • Height
    880μm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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