Toshiba 2SK1489

Factory Lead Time

18 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Package Description

2-21F1B, 3 PIN

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

No

Manufacturer Part Number

2SK1489

Package Shape

RECTANGULAR

Manufacturer

Toshiba America Electronic Components

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TOSHIBA CORP

Risk Rank

5.8

Drain Current-Max (ID)

12 A

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

240

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

Drain-source On Resistance-Max

1 Ω

Pulsed Drain Current-Max (IDM)

36 A

DS Breakdown Voltage-Min

1000 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation Ambient-Max

200 W