2063624-2

TE Connectivity / AMP 2063624-2

Part No:

2063624-2

Datasheet:

-

Package:

-

AINNX NO:

31088419-2063624-2

Category:

Punches

Description:

Punches & Dies SDE MCP2.8 0.5-1.0mm2 DIE SET

Products specifications
  • RoHS
    Not Applicable
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Crimping
  • Product
    Dies
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