2063438-2
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31077077-2063438-2
Punches & Dies SDE UMNL 1.5-2.5mm2 DIE SET
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
2063379-2
TE Connectivity / AMPPunches & Dies SDE UMNL 0.5-2.0mm2 DIE SET2063677-2
TE Connectivity / AMPPunches & Dies SDE MCP1.5 1.5mm2 DIE SET2063520-2
TE Connectivity / AMPPunches & Dies SDE UMNL 0.2-0.82mm2 DIE SET2063438-2
TE Connectivity / AMPPunches & Dies SDE UMNL 1.5-2.5mm2 DIE SET2063624-2
TE Connectivity / AMPPunches & Dies SDE MCP2.8 0.5-1.0mm2 DIE SET2031991-2
TE Connectivity / AMPPunches & Dies SDE JPT 12-24AWG DIE SET2063537-2
TE Connectivity / AMPPunches & Dies SDE MCON1.2 0.5-0.75mm2 DIE SET2063534-2
TE Connectivity / AMPPunches & Dies SDE MCP2.8 0.5-1.0mm2 DIE SET2063041-2
TE Connectivity / AMPPunches & Dies SDE MQS 0.25-0.5mm2 DIE SET2063384-2
TE Connectivity / AMPPunches & Dies SDE FASTON 250 1.0-2.5mm2 DIE SET