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2134439-3
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51007599-2134439-3
ILM ASSY WITH LABEL WIDE TYPE LGA2011
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

3-2330550-1
TE ConnectivityICX TFLM ASSEMBLY
2-2330550-1
TE ConnectivityICX TFLM ASSEMBLY
2299805-1
TE ConnectivityNRW Backplate Assembly for LGA 3647 Socket Nickel Plated Steel Tray/Box
2299804-3
TE ConnectivityNRW Non-Fabric Bolster Assembly for LGA 3647 Socket Stainless Steel Tray/Box
2-2134533-2
TE ConnectivityConnector Accessories Backshell 8POS/12POS Side B RA NW7.5 Cable Exit Polyamide 66/6 Black
2299805-3
TE ConnectivityNRW Backplate Assembly for LGA 3647 Socket Nickel Plated Steel Tray/Box
3-2330550-2
TE ConnectivityBolster Assembly Stainless Steel for LGA4189 Sockets Box
2310924-1
TE ConnectivityNRW Fabric Bolster Plate Assembly with Cover Stainless Steel Tray
2-2330551-1
TE ConnectivityICX BACKPLATE ASSEMBLY
2013882-2
TE ConnectivityConnector Accessories ILM Assembly Straight Steel Nickel Bag/Box