TE Connectivity 2299805-3

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

-

Housing Material

Steel

Body Orientation

Straight

Operating Temp Range

-25C to 100C

Product Diameter (mm)

Not Required(mm)

Package Type

LGA

For Use With

AMP LGA 3647 Sockets

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 100 C

Minimum Operating Temperature

- 25 C

Factory Pack QuantityFactory Pack Quantity

12

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

RoHS

Details

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box or Tray

Type

LGA 3647 Backplate

Number of Positions

-

Number of Rows

-

Subcategory

IC & Component Sockets

Pitch

-

Termination Style

-

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

-

Accessory Type

Backplate

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

IC & Component Sockets

Product

Accessories

Product Category

a particular group of related products.

IC & Component Sockets

Product Length (mm)

82.1(mm)

Product Height (mm)

7.74(mm)