B65524C1004T001
QFN
36822583-B65524C1004T001
BOBBIN COIL FORMER P 9 X 5
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
a count of all of the component leads (or pins)
the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.
a group of products which fulfill a similar need for a market segment or market as a whole.
The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.
a particular group of related products.