B65522B0000T001
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50888544-B65522B0000T001
Ferrite Accessories, PM Cores Accessories(PM/P/PS), Coil former (P 9 x 5)
Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
a group of products which fulfill a similar need for a market segment or market as a whole.
The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.
a particular group of related products.