TDK Electronics Inc. B66363G2500X187

Factory Lead Time

19 Weeks

Supplier Device Package

ETD 39 x 20 x 13

Material

N87

Core Factor (ΣI/A) mm-1

0.74

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2013

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Inductance

2.5 μH

Finish

Uncoated

Core Type

ETD

Effective Area (Ae) mm2

125

Effective Length (le) mm

92.2

Effective Magnetic Volume (Ve) mm3

11500

Initial Permeability (μi)

2200

Minimum Core Cross Section (Amin) mm2

123

Height

20.00mm

Length

38.90mm

Width

12.80mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant