TDK Electronics Inc. B64290L0699X065

Lifecycle Status

PRODUCTION (Last Updated: 2 months ago)

Factory Lead Time

6 Weeks

Material

T65

Core Factor (ΣI/A) mm-1

0.5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

B64290

Published

2017

Tolerance

±30%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Inductance

12.6 μH

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

63 mm

Finish

Epoxy

Core Type

Toroid

Gap

Ungapped

Effective Area (Ae) mm2

305.9

Effective Length (le) mm

152.1

Effective Magnetic Volume (Ve) mm3

46530

Initial Permeability (μi)

5000

Inductance Factor (Al)

12.6μH

Diameter

65.30mm

Height

26.60mm

Diameter - Inside

38 mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant