STMicroelectronics STL8DN10LF3

Factory Lead Time

12 Weeks

Lifecycle Status

ACTIVE (Last Updated: 7 months ago)

Package / Case

8-PowerVDFN

Mounting Type

Surface Mount

Mount

Surface Mount

Number of Pins

8

Transistor Element Material

SILICON

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

50.6 ns

Number of Elements

2

Series

Automotive, AEC-Q101, STripFET™ III

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C~175°C TJ

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

6

ECCN Code

EAR99

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AVALANCHE RATED

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

70W

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

FLAT

Base Part Number

STL8

JESD-30 Code

R-PDSO-F6

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

70W

Case Connection

DRAIN

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

8.7 ns

FET Type

2 N-Channel (Dual)

Transistor Application

SWITCHING

Rds On (Max) @ Id, Vgs

35m Ω @ 4A, 10V

Vgs(th) (Max) @ Id

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds

970pF @ 25V

Gate Charge (Qg) (Max) @ Vgs

20.5nC @ 10V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

9.6ns

Drain to Source Voltage (Vdss)

100V

Fall Time (Typ)

5.2 ns

Continuous Drain Current (ID)

20A

Gate to Source Voltage (Vgs)

20V

Drain-source On Resistance-Max

0.05Ohm

Drain to Source Breakdown Voltage

100V

Pulsed Drain Current-Max (IDM)

31.2A

Avalanche Energy Rating (Eas)

190 mJ

FET Technology

METAL-OXIDE SEMICONDUCTOR

FET Feature

Logic Level Gate

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free