STMicroelectronics PD55008TR-E

Factory Lead Time

25 Weeks

Mount

Surface Mount

Package / Case

PowerSO-10RF Exposed Bottom Pad (2 Formed Leads)

Number of Pins

3

Number of Elements

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

2

ECCN Code

EAR99

Terminal Finish

Matte Tin (Sn) - annealed

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

165°C

Min Operating Temperature

-65°C

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HIGH RELIABILITY

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

52.8W

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

250

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

4A

Frequency

500MHz

Time@Peak Reflow Temperature-Max (s)

30

Base Part Number

PD55008

Pin Count

a count of all of the component leads (or pins)

10

JESD-30 Code

R-PDSO-G2

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Single

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

52.8W

Case Connection

SOURCE

Current - Test

150mA

Transistor Application

AMPLIFIER

Drain to Source Voltage (Vdss)

40V

Polarity/Channel Type

N-CHANNEL

Transistor Type

LDMOS

Continuous Drain Current (ID)

4A

Gate to Source Voltage (Vgs)

20V

Gain

17dB

Max Output Power

The maximum output power = the maximum output current × the rated output voltage

8W

Drain Current-Max (Abs) (ID)

4A

Drain to Source Breakdown Voltage

40V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Voltage - Test

12.5V

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant