SMC Corporation 20-CJPB6-5H4

Lifecycle Status

Production (Last Updated: 2 years ago)

Mount

Surface Mount

Number of Pins

2

Number of Elements

1

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Color

White

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

5 W

Depth

3.45 mm

Max Current Rating

1.5 A

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

125 °

Forward Current

Current which flows upon application of forward voltage.

350 mA

Test Current

350 mA

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

2.9 V

Illumination Color

White

Luminous Flux

the measure of the perceived power of light.

100 lm

Color Rendering Index (CRI)

80

Width

3.45 mm

Height

2.36 mm

Length

3.45 mm