MY1B32-500H-Y7BW3

SMC Corporation MY1B32-500H-Y7BW3

Part No:

MY1B32-500H-Y7BW3

Manufacturer:

SMC Corporation

Datasheet:

-

Package:

-

AINNX NO:

40170718-MY1B32-500H-Y7BW3

Description:

CYL, RODLESS, MECH JOINT

Products specifications
  • Lead Free Status / RoHS Status
    --
  • Contact Sizes
    4
  • Contact Materials
    Copper Alloy
  • RoHS
    Non-Compliant
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Machined
  • Contact Type
    Socket
  • Contact Finish
    Silver
  • Wire Gauge or Range - AWG
    4-6 AWG
  • Contact Termination
    Crimp
  • Wire Gauge or Range - mm²
    --
  • Termination Finish
    Tin
  • Features
    --
  • Wire Gauge or Range - Coaxial
    --
  • Contact Finish Thickness
    Flash
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