Sensata-Crydom HSP-3

Factory Lead Time

4 Weeks

Mount

External

Material

Polyamide

Shape

Rectangular

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

HSP

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Pad, Sheet

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Color

White

Usage

Three Phase SSRs

Outline

104.39mm x 73.66mm

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

1.0W/m-K

Length

104.1mm

Width

73.7mm

Thickness

0.0039 0.100mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free