Sensata-Crydom HSP-1

Factory Lead Time

4 Weeks

Shape

Rectangular

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Series

HSP

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Pad, Sheet

Color

White

Usage

Single Phase SSRs, M50 Power Modules

Outline

57.15mm x 44.45mm

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

1.0W/m-K

Width

44.5mm

Thickness

0.0039 0.100mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant