
HS-QSFP-P1-04-LP
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28809147-HS-QSFP-P1-04-LP
HEAT SINK FLYOVER 1.5MM
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.
Quantity
Unit Price
Ext. Price
1+
$395.931537
$395.92
10+
$373.520360
$3,735.17
100+
$352.377659
$35,237.82
500+
$332.431765
$166,215.85
1000+
$313.614862
$313,614.89
* The above prices does not include taxes and freight rates, which will be calculated on the order pages.