Samtec Inc. UCC8-010-1-H-S-1-A

Factory Lead Time

3 Weeks

Mount

Through Hole

Mounting Type

Surface Mount, Through Hole

Contact Materials

BERYLLIUM COPPER

Insulation Materials

LIQUID CRYSTAL POLYMER (LCP)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

Firefly™

Published

2017

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Connector Type

Micro Flyover

Number of Positions

10

Number of Rows

1

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

800μm

Total Number of Contacts

10

Number of Conductors

ONE

Reference Standard

UL

Contact Finish

Gold

Reliability

COMMERCIAL

Body Length or Diameter

0.443 inch

Number Of PCB Rows

1

PCB Contact Pattern

RECTANGULAR

Mating Information

MULTIPLE MATING PARTS AVAILABLE

Contact Gender

FEMALE

UL Flammability Code

94V-0

Rated Current (Signal)

2.6A

Contact Style

COMPRESSION

Body/Shell Style

SOCKET

Connector Style

Receptacle

Contact Pattern

RECTANGULAR

Insulator Color

BLACK

Features

Board Guide

Contact Finish Thickness

30.0μin 0.76μm

Plating Thickness

30μin

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant